AMD’s latest patent filing has given us a sneak peek into their plans for the future of Ryzen SoCs, highlighting an innovative "multi-chip stacking" technique aimed at enhancing die scalability.
AMD’s Forward Thinking: Stacking Chips with Precision and Purpose
AMD, always pushing the envelope when it comes to advancements in consumer CPUs, was the first to roll out the "3D V-Cache" with its "X3D" series. This recent patent filing, shared by @coreteks, suggests that AMD is contemplating a fresh packaging design. This new approach to chip stacking promises to minimize interconnect delays and boost performance significantly.
The patent outlines a strategy where smaller chiplets are partially overlapped by a larger die. This novel setup allows AMD to pack more functionality into a single chip, maximizing the use of available space. Essentially, this means that with the same physical die size, AMD could potentially incorporate more cores, expand caches, and increase memory bandwidth, leading to a major jump in performance capabilities.
One standout feature of this stacking technique is its potential to cut down interconnect latency. Overlapping the chiplets reduces the distance between components, ensuring quicker communication. Additionally, this method addresses power gating efficiently, as separate chiplets allow for better control over individual units.
AMD’s venture into "multi-chiplet" technology isn’t confined to CPUs alone; they’re exploring similar pathways for their GPUs. As highlighted in a prior report, AMD is seriously considering "multi-chiplet" GPU designs, indicating their focus on moving away from traditional monolithic structures. This exploration into chiplet configurations could easily extend to their mainstream Ryzen SoCs, much like the "X3D" CPUs.
To stay ahead of the curve and compete with the rising pressure from Intel, AMD’s commitment to innovation, particularly in embracing "multi-chiplet" designs, could redefine their dominance in the CPU market.
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